Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem Expected outcomes should have direct and immediate impact on European industry. Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7.
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Does your company qualify?
Give a few facts about your company and project, and see for each condition whether you meet it.
Eligibility checkGrant from SBEP (EU-funded project) across the EU. Total budget €37,723,260. Applications until 16 November 2026.
- Fully programmable industry-ready quantum simulators based on 10.000 neutral atoms in a scalable architecture, accessible via cloud platforms, and with the possibility of integrating them…
Grant from UPRAISE (EU-funded project) across the EU. Total budget €20,000. Applications until 18 November 2026.
A check is an indication from the published conditions and the facts you give. Only the competent authority decides whether you are eligible.