Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem Expected outcomes should have direct and immediate impact on European industry. Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7.
No testable conditions are recorded for this measure yet. Read the conditions on the official page.
Does your company qualify?
Give a few facts about your company and project, and see for each condition whether you meet it.
Eligibility checkGrant from VIC (EU-funded project) across the EU. Total budget €4,000. Applications until 30 September 2026.
Grant from VIC (EU-funded project) across the EU. Total budget €5,000. Applications until 30 September 2026.
The objective is to deliver three to four projects that demonstrate the streamlining of regulatory reporting through automated and trusted sharing of compliance data. Each project will addr…
A check is an indication from the published conditions and the facts you give. Only the competent authority decides whether you are eligible.