- Demonstrated innovations that substantially improve heat removal from high-power AI chips (e.g. direct on-chip cooling, advanced thermal interface materials, multi-scale thermal management), enabling higher performance without thermal throttling. This should lead to lower cooling energy needs and higher reliability for dense AI workloads. - Prototypes of novel backup power systems (such as graphene-enhanced batteries) that operate with minimal cooling requirements, improving data centre resilience and enabling better use of renewable power.
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At least 3 independent partners
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Give a few facts about your company and project, and see for each condition whether you meet it.
Eligibility checkGrant from BATTLEVERSE (EU-funded project) across the EU. Total budget €1,200,000. Applications until 16 November 2026.
Grant from UPRAISE (EU-funded project) across the EU. Total budget €20,000. Applications until 18 November 2026.
This action builds on the MSCA Doctoral Networks 2026 call (HORIZON-MSCA-DN-2026). - New research and transferable skills and competences in the application of AI in science, leading to imp…
A check is an indication from the published conditions and the facts you give. Only the competent authority decides whether you are eligible.